PRESS-FIT High-current contacts

• Force/displacement process monitoring when pressing in the PRESS-FIT terminals
• Validation of the end position without overloading the assembly/conductor plate
• Optimized for manual and automated processes

Task

In addition to the high current density per surface area, PRESS-FIT high-current contacts also have the best thermal and mechanical properties. In addition, lower contact resistances are achieved compared to soldering technology. The decisive factor for the quality of the energy-carrying contact point is a supported and uniform press-fit process without complete pressing onto the assembly. Force/displacement process monitoring is essential for validating this process.

SPECIAL FEATURES

• Force/displacement process monitoring optimized for manual and automatic presses
• Variable fieldbus and communication interfaces for all PLC and host environments

SOLUTION

The manual or automatic press is equipped with force and displacement sensors. Sensors from the burster 8451 and 8552 series are suitable for presses with round slide mounts. Displacement detection is often carried out with potentiometric displacement sensors, whereby versions with spring extension or guided push rod, such as series 8710 or 8712, can be used individually depending on the design of the press. The dimensioning of the press and the force sensor should be designed according to the maximum press-in forces of the PRESS-FIT contacts. Ensure that the press-fit zone is equipped with a suitable base, e.g. a die, to prevent damage to the assembly. The DIGIFORCE^® 9307/9311 force/displacement monitor can validate the quality-relevant parameters of the press-fit phase and, above all, the end position. Faulty overload situations, e.g. due to pressing up to the block, are detected by an NOK evaluation and can be ejected. QA-relevant process values are available immediately after pressing and can be read via fieldbus or open communication interfaces.

FAQ: How does PRESS-FIT technology work?
Press-fit technology is a solderless connection technique for printed circuit boards in which a contact pin is pressed into the metallized hole (through-hole plating) of a printed circuit board. In most cases, additional mechanical fastening is not required. The counterpart of the electrical connection of the press-fit contact can be, for example, a winding connection, a flat plug sleeve, a threaded bolt or a plug connector (source Wikipedia).